Rack Density
Direct-to-chip cooling removes heat close to CPUs and GPUs where air cooling becomes constrained.
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AI Infrastructure
Liquid cooling for high-density AI infrastructure.
Direct-to-chip liquid cooling architecture for dense AI training and compute workloads.
Operating Challenge
AI workloads create changing thermal demand across the data hall.
Changes in AI training and compute cycles create varying flow and temperature demands from rack to rack.
Dynamic Load
Flow and supply temperature must remain controlled while compute demand changes between racks.
Service Continuity
Loop isolation, monitoring, redundancy, and maintainable interfaces are planned before deployment.
Cooling Path
Controlled coolant delivery from the facility loop to the cold plate.
Equipment sizing and interface selection are based on site water, server requirements, rack count, and redundancy targets.
01Heat RejectionIntegrated cooling station or facility water
02CDU ControlLoop isolation, pumping, heat exchange, monitoring
03Rack DistributionSecondary piping, manifolds, hoses, and interfaces
04Direct-to-ChipCold plates capture heat at the processor
Deployment Options
Rack-side equipment aligned to the cooling architecture.
DLC 150 L2L
In-Rack CDU
Compact heat exchange, pumping, monitoring, and pressure control close to the compute load.
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DLR Series
Liquid-Cooled Rack Deployment
Populated rack rows with manifolds and branch hoses coordinated for direct-to-chip server loops.
View productEngineering Review
Define rack count, density, coolant, and delivery timing.
JR Cooling will map the project inputs to a preliminary cooling architecture.