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Resources Overview

Product documents for engineering review.

Current English brochures and configuration catalogs for rack-level liquid cooling products.

Updated Product Literature

Brochures revised for the current product presentation.

Contact details, product images, interfaces, and engineering descriptions have been updated in the current editions.

Engineering Notes

System-level decisions for direct-to-chip liquid cooling.

Direct-to-chip cooling uses cold plates to capture heat at processors while the CDU and distribution loop control coolant conditions.

CDU Selection

Compare cabinet and in-rack platforms by load, footprint, loop arrangement, power, and redundancy.

Review CDU platform

Secondary Distribution

Define routes, connection standards, pressure class, bleeding, draining, and future expansion.

Review piping

Rack-Side Delivery

Coordinate manifolds and branch hoses with server cold plates and service requirements.

Review rack system

FAQ

Common questions during early project planning.

Final answers depend on the server platform, facility water, load profile, deployment model, and required standards.

What information is needed to size a CDU?

Provide total heat load, rack count and density, server-side flow and pressure limits, temperatures, primary-water conditions, redundancy target, coolant, and controls requirements.

Can the architecture support direct-to-chip liquid cooling?

Yes. The system path can include CDU loop isolation, secondary piping, rack manifolds, hoses, and interfaces serving processor cold plates. Compatibility must be confirmed with the server supplier.

Can products be configured for a project?

Connections, dimensions, capacity, controls, communication, materials, pressure class, and distribution layout can be reviewed against project requirements.

How do I request current technical information?

Email Sales@jrcoolingtech.com or submit the Request a Quote form with the available project inputs.